EVENTS

Date

Oct 31 2021 - Nov 04 2021
Expired!

Local Time

  • Timezone: America/Los_Angeles
  • Date: Oct 31 2021 - Nov 04 2021
  • Time: All Day

Organizer

ASM International
Website
https://www.asminternational.org/web/guest/home

ISTFA 2021

Riding the Wave of System-in-Package (SiP)

In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access of information, and communications anywhere in a personalized fashion and at affordable prices.  The new challenge is not how many transistors can be built on a single chip as in SoC (System-on-Chip), but rather how to integrate diverse circuits together predictably, harmoniously and cost effectively.  Instead of getting twice the transistors for the same cost as Moore’s Law predicted in the past 50 years, the goal of SIP is to obtain the same number of transistors for half the cost within less than half the time to market.  What are the challenges that growing SiP technology bring to the failure analysis from sample preparation, fault isolation, to physical defect localization and root cause identification?

 

Share your experiences and advance the industry and your career at the 47th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Phoenix, Arizona for the 47th year of ISTFA.

ISTFA 2021

Riding the Wave of System-in-Package (SiP)

In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access of information, and communications anywhere in a personalized fashion and at affordable prices.  The new challenge is not how many transistors can be built on a single chip as in SoC (System-on-Chip), but rather how to integrate diverse circuits together predictably, harmoniously and cost effectively.  Instead of getting twice the transistors for the same cost as Moore’s Law predicted in the past 50 years, the goal of SIP is to obtain the same number of transistors for half the cost within less than half the time to market.  What are the challenges that growing SiP technology bring to the failure analysis from sample preparation, fault isolation, to physical defect localization and root cause identification?

 

Share your experiences and advance the industry and your career at the 47th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Phoenix, Arizona for the 47th year of ISTFA.

Date

Oct 31 2021 - Nov 04 2021
Expired!

Local Time

  • Timezone: America/Los_Angeles
  • Date: Oct 31 2021 - Nov 04 2021
  • Time: All Day

Location

Phoenix Convention Center
100 North Third Street, Phoenix, AZ 85004
Website
https://www.phoenixconventioncenter.com/

Organizer

ASM International
Website
https://www.asminternational.org/web/guest/home

Date

Oct 31 2021 - Nov 04 2021
Expired!

Local Time

  • Timezone: America/Los_Angeles
  • Date: Oct 31 2021 - Nov 04 2021
  • Time: All Day

Location

Phoenix Convention Center
100 North Third Street, Phoenix, AZ 85004
Website
https://www.phoenixconventioncenter.com/

Organizer

ASM International
Website
https://www.asminternational.org/web/guest/home

ISTFA 2021

Riding the Wave of System-in-Package (SiP)

In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access of information, and communications anywhere in a personalized fashion and at affordable prices.  The new challenge is not how many transistors can be built on a single chip as in SoC (System-on-Chip), but rather how to integrate diverse circuits together predictably, harmoniously and cost effectively.  Instead of getting twice the transistors for the same cost as Moore’s Law predicted in the past 50 years, the goal of SIP is to obtain the same number of transistors for half the cost within less than half the time to market.  What are the challenges that growing SiP technology bring to the failure analysis from sample preparation, fault isolation, to physical defect localization and root cause identification?

 

Share your experiences and advance the industry and your career at the 47th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Phoenix, Arizona for the 47th year of ISTFA.

We're Here to Help

Resources

Related Companies

FELECIA STIVERS

Field Sales Engineer

Felecia Stivers, a native of Rockford, IL, now excels as a Field Sales Engineer at VMA in our Arizona office. Holding a BSEE from Arizona State University, she draws from her extensive background at Medtronic, Orbital Sciences, General Dynamics, and Northrop Grumman.

Specializing in high-reliability applications, Felecia stands out for her proficiency in relationship-building and innovative problem-solving. Whether contributing to medical devices or playing a vital role in rocket launches, her work has had a tangible impact on saving lives and safeguarding the nation.

Beyond her professional pursuits, Felecia enjoys time with her two teenagers, finds joy in travel, and actively engages with her local church. Driven by a passion for helping customers navigate cutting-edge technology, she is committed to delivering dependable solutions in fast-changing environments.

KAREN M. ROSS

People and Culture Specialist

Karen has been a part of Vic Myers Associates team since February 2023. Prior to her position as People and Culture Specialist, she worked in the Science & Technology field as an HR Manager & Project Lead for SAIC and LANL. In the short time with VMA she has learned a lot and looks forward to knowing our business even better in support of all of our employees. She values her church community, her two sons who happen to be engineers, volunteering, and golf. Karen is located in our Albuquerque, NM office.

Natalie Myers

Inside Sales Administration

Natalie Myers joined Vic Myers Associates in September 2021 and is excited to be part of the team. She received her bachelor’s in business administration from the University of Phoenix and prior to her position as Inside Sales Administration she worked in the Hospitality Industry for over 15 years as a Senior Sales Administrator. In her free time, she enjoys spending time with her husband, daughter, family and friends along with watching sporting events, traveling, hiking and cheering on her daughter in dance and basketball! Natalie is located in our Arizona office.

SEARCH OUR WEBSITE

Can’t find what you’re looking for?