product resource handbook

Building Rugged COM Express Systems

Simplifying the Design of a Custom, Type 6 COM Express System.

Why Choose COM Express?

Designed specifically for the MIL-AERO market, Acromag introduces a truly flexible hardware platform that provides you with off-the-shelf, advanced technology to satisfy a multitude of project requirements. 

Quickly go from development to production using Acromag’s line of modular COM Express products.

Why Choose COM Express?

Designed specifically for the MIL-AERO market, Acromag introduces a truly flexible hardware platform that provides you with off-the-shelf, advanced technology to satisfy a multitude of project requirements.Express products.

 
What Do I Need to Get Started?
  • While mixing-and-matching an assembly is possible, Acromag cuts out the headaches
    by offering all of the pieces for a comprehensive package:
  • XCOM-6400 Intel i7/i5 CPU processor board
  • ACEX carrier cards
    • Production front panels
    • Front panel power filter
      Engineering Design Kit for real-world I/O interfacing
How It All Comes Together
 

1. The Processor : XCOM-6400

  • Type 6 interconnects
  • Intel 4th Gen Core i7/i5 CPU
  • Intel 8-Series QM87 PCH chipset
  • Up to 16GB removable memory
  • PEG/General Purpose PCIe x16
  • 40 to 85°C operating temperature

The XCOM-6400 CPU processor module has Type 6 interconnects and features the 4th generation “Haswell” Intel processor. The Core i5 allows for lower power consumption (around 20-40%), while the Core i7 provides higher performance- as much as twice the performance of “Sandy Bridge” (3rd generation).

Both processors deliver the many enhanced media, graphic, security, and power capabilities typical for Intel’s 4th generation products. Huge performance improvements were made for floating-point-intensive computations which are critical for digital, signal, and image processing applications – such as radar and sonar.

Enhanced graphics enable smoother playback of high-resolution images for digital signage or displays. Improved power efficiency reduces heat and allows smaller, lighter designs with better portability.

The XCOM-6400 also features an innovative SODIMM hold down mechanism which allows up to 16GB of high-speed DDR3L memory to be securely fastened without the limitations of soldered-down memory. Meeting the higher standards of MIL-STD202G shock and vibration testing, a screw-down latch holds the memory in place without a loss of connection and also serves as a conduction plate to dissipate heat.

2. The Carriers : ACEX4600

  • Dual Mini PCIe sites for I/O expansion
  • Optional single or double slot
  • PMC/XMC expansion
  • Multi-pin SEARAY connectors for
    real-world interconnection
  • Conduction cooling frames and rails
    available
  • On-board DC/DC power supply -40 to 85°C operating temperature

The ACEX4600 Type 6 COM Express carrier cards come in three variations, depending on which features you prefer.

All models feature an integrated DC power supply with 10-32V DC input. The boards are ready for conduction cooling and employ a number of key industrialized features that are critical for use in harsh environments. High-density, high-speed Samtec SEARAY connectors provide all field connections to standard I/O, CPU and rear PMC/XMC I/O. The connector supports either a cable or board-to-board interface. Using these standard carriers will save months of development time and thousands of dollars in engineering costs.

3. PMC/XMC Expansion

Acromag offers several families of XMC or PMC boards, allowing you to modify and customize your system to meet specific application needs and requirements.

  • Analog and digital I/O
  • FPGA modules
  • 10-Gigabit Ethernet network cards
  • Multi-purpose I/O cards

4. The Production Front Panels : ACEX-FP

The I/O front panel has MIL-DTL38999 cylindrical connectors for interfacing to the outside world.  Two models are available for use with either the  zero/single or the dual PMC/XMC slot carrier. All PMC/XMC rear I/O is routed to the front panel connectors.

5.  The Front Panel Power Filter : ACEX-FP-PF

The front panel power filter interfaces directly to the back of the front I/O card and
provides filtering for the incoming power.

6. The Engineering Design Kit : ACEX-4600-EDK

The Engineering Design Kit (EDK) provides an easy means of developing and testing your COM Express application. Designed to plug directly
into the carrier card, it allows access to all signals delivered through the carrier card’s SEARAY connector from the EDK board connectors. The EDK
provides all of the peripheral I/O connectors from the CPU, I/O expansion modules, and accommodates two SSD devices for program storage.

The ACEX-4600-EDK is also offered in a packaged version: model ACEX-4600-DLS, designed for your laboratory use. It provides all of the features of the EDK with the added advantage of being mounted on a metal base with two fans that insure proper air circulation around and over the CPU, carrier, and expansion modules.

 

SEARCH OUR WEBSITE

Can’t find what you’re looking for?

Natalie Myers

Inside Sales Administration

Natalie Myers joined Vic Myers Associates in September 2021 and is excited to be part of the team. She received her bachelor’s in business administration from the University of Phoenix and prior to her position as Inside Sales Administration she worked in the Hospitality Industry for over 15 years as a Senior Sales Administrator. In her free time, she enjoys spending time with her husband, daughter, family and friends along with watching sporting events, traveling, hiking and cheering on her daughter in dance and basketball! Natalie is located in our Arizona office.

KAREN M. ROSS

People and Culture Specialist

Cell Phone: 505-720-9123
Email: karenr@vicmyers.com

Karen has been a part of Vic Myers Associates team since February 2023. Prior to her position as People and Culture Specialist, she worked in the Science & Technology field as an HR Manager & Project Lead for SAIC and LANL. In the short time with VMA she has learned a lot and looks forward to knowing our business even better in support of all of our employees. She values her church community, her two sons who happen to be engineers, volunteering, and golf. Karen is located in our Albuquerque, NM office.

FELECIA STIVERS

Field Sales Engineer

Felecia Stivers, a native of Rockford, IL, now excels as a Field Sales Engineer at VMA in our Arizona office. Holding a BSEE from Arizona State University, she draws from her extensive background at Medtronic, Orbital Sciences, General Dynamics, and Northrop Grumman.

Specializing in high-reliability applications, Felecia stands out for her proficiency in relationship-building and innovative problem-solving. Whether contributing to medical devices or playing a vital role in rocket launches, her work has had a tangible impact on saving lives and safeguarding the nation.

Beyond her professional pursuits, Felecia enjoys time with her two teenagers, finds joy in travel, and actively engages with her local church. Driven by a passion for helping customers navigate cutting-edge technology, she is committed to delivering dependable solutions in fast-changing environments.

TAYLOR GAUNTT

Field Sales Engineer

Taylor is a Texas native, and grew up in the small town of Boerne, Texas.  He attended Texas A&M University, where earned his bachelor’s degree in Engineering.  After college he was recruited by a Manufacturer’s Rep Firm, where he spent the first 7 years of his career. Initially hired on as an inside salesperson, Taylor quickly accelerated within the organization and expanded into various other roles such as Distribution Manager, and Field Sales Engineer.  Taylor then spent the following 7 years working for an electronic component distributor named Electro Enterprises that almost exclusively supported the mil/aero market.

Taylor worked as a Field Sales Engineer supporting the Texas, Utah and New Mexico territory, Product Manager, as well as Director or Business Development where he managed a team of 10 Field Sales Professionals across the entire United States.  Gathering from his previous experiences, Taylor has now taken on the role of Field Sales Engineer with Vic Myers supporting the Texas, Oklahoma, Louisiana, and Arkansas territory.  Outside of the office you will usually find Taylor either spending time with his wife and two young children, or out on the lake bass fishing.

RICHARD MENDEZ

Sales Engineer

Richard was born and raised in Arizona. Attended Arizona State University with a focus in Mechanical Engineering and then fell into Technical Project Management. After 12 years of managing large budget projects spanning system integrations and upgrades, he transitioned into the role of Field Sales Engineer with VMA.

Richard has a deep passion for building relationships with his clients and principals, and supporting them to problem solve and develop innovative solutions. Outside of the office, Richard can be found volunteering as a mentor and coach of high school students at his church, running and hiking the extensive trails of Arizona, and spending time with his wife, 2 boys, 2 girls, and 2 grandkids. Richard is located in our Arizona office.

TARIN SCHONCHECK

Sales Administration

Cell Phone: 480-345-6449
Email: tarins@vicmyers.com

Tarin was born and raised in Wisconsin, graduated from the University of Wisconsin-Stout and received a Bachelor of Science degree in Business Administration. Prior to Vic Myers she worked in the hospitality industry 20+ years as a Sales Analyst/Administrator.

In her spare time, Tarin enjoys spending time with her family, traveling to historical sites throughout the United States, reading, going to movies and concerts. On the weekends you will find Tarin at her nephews’ band concerts and baseball games. In addition, music and dance have been a part of her life with musical contrasting influences ranging from Prince to Olivia Newton-John.  Tarin is located in our Arizona office.